Environmental conditions have a great influence on the functionality and reliability of the electronic components, devices and systems. A normal temperature test is often not sufficient to detect latent weak points as quickly as possible. Samples must be subjected to multiple, shock like temperature changes. With thermal shock test chamber extremely fast temperature changes from –55 °C to +150 °C can be achieved. This helps you to reduce early failures and to increase the reliability of your products. Reproducible, certified and under accelerated conditions.
IEC 60068-2-14 Na
MIL-STD-810H, Method 503.7
MIL-STD-883L-1, Method 1010.9
JASO D 014-4
?Quality assurance: The chamber is designed according to the international standard, core components are all from the global renowned brand.
?Easy control: 7 inches color touch control panel with large data storage of 1200 days, automatically analyse failure and display measures.
?Short preheat or precool waiting time and defrosting.